Laser Micro-Machining Technology for Brittle Materials-ShangHai RunQia Electronics Technology Co.,Ltd.

Laser Micro-Machining Technology for Brittle Materials

With the progress of the times, brittle materials are being applied more and more widely, covering mobile phones, iPads, televisions, computer displays, LED and OLED products, as well as other microelectronic products, glass substrates for integrated circuits, optical devices, medical equipment, semiconductors and more.

Traditional mechanical processing equipment cannot achieve breakthroughs in efficiency and precision when machining brittle materials. Along with the continuous upgrading and iteration of brittle materials, the adoption of more advanced laser technology has become particularly essential, especially in the field of micro and ultra-fine machining.

After years of technological accumulation, driven by strong market demand as well as continuous requirements for fewer processing steps, reduced material waste and dry manufacturing processes, many processing methods have achieved experimental breakthroughs.

For instance, ultrafast picosecond laser cutting of sapphire thin sheets delivers clean and neat surfaces without chipping or cracking, while featuring high processing speed. Accordingly, the development of ultrafast laser technology will further expand the application scope of brittle materials.

Ultrafast lasers are applicable to the cutting, drilling and grooving of brittle materials such as glass, ceramics and sapphire. The machining features minimal edge chipping, zero taper, high efficiency and superior surface finish. In addition, it can realize the removal of surface ink and PVD coatings, as well as multi-focal and long-focal stealth cutting for transparent materials.

Conventional laser processing is unable to meet stringent requirements including machining precision within 0.05 mm, arc radius R of 0.03 mm, and cutting position spacing within 0.5 mm. In contrast, picosecond laser cutting machines feature higher laser frequency and narrower pulse width, enabling faster processing and higher machining quality.

The cutting edges are neat, smooth and round with no burrs, glue overflow or black edges. The software operation is intuitive and user-friendly, supporting one-click integrated processing. Equipped with high-power, stable and reliable lasers with field-replaceable consumables, Shoulei Laser achieves lower maintenance costs compared with industry peers.

Ultrafast picosecond lasers (50 W laser power, 1–5 picosecond pulse width, 25 μJ) and ultrafast femtosecond lasers (50 W laser power, 350–500 femtosecond pulse width, 25 μJ) feature compact size, light weight, high safety and reliability, high efficiency, high temperature control accuracy and low noise.

Picosecond and femtosecond laser machining possess outstanding advantages and broad development prospects.

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