Ultrafast laser equipment

Laser micro-nano processing equipment utilizes high-performance ultraviolet lasers, featuring stable laser power and excellent beam quality. The cutting end face is smooth, with low thermal stress and thermal impact, making it suitable for cutting, drilling, surface micro-structuring (biomimetic structures), scribing, and notching of ultra-thin metal materials (copper, gold, silver, aluminum, titanium, nickel, stainless steel, molybdenum, etc.), flexible materials (PET, PI, PP, PVC, Teflon, electromagnetic films, adhesive films, etc.), graphene, carbon fiber, silicon wafers, ceramics, FPC, as well as micro-processing of polymer materials and composite materials.

1. The cutting edge has good quality, with no taper on the fracture surface and high static pressure strength; 2. Using picosecond or femtosecond lasers, ultrashort pulse processing without thermal conduction is suitable for high-speed cutting and drilling of any organic & inorganic materials, with a minimum edge chipping and heat-affected zone of 2μm; 3. CCD visual positioning, effective processing area 250mm×250mm, XY platform accuracy ≤±300nm; 4. Supports multiple visual positioning features, such as crosses, solid circles, hollow circles, L-shaped right-angled edges, and image feature points; 5. With fast cutting speed, it significantly enhances productivity. The equipment requires no consumables, offering a notable cost advantage.

Ultrafast laser equipment's micro-nano precision advantage

Picosecond cooling laser: picosecond cooling removal, no thermal effect, good flexibility in processing various materials;

Laser cutting without stress: When exposed to light, the material sublimates, eliminating the need for contact and thus avoiding stress-induced damage. With specialized carriers in conjunction with laser processing, even components closely spaced to the cutting path are unaffected by stress, ensuring rapid board separation;

Precise control of thermal effects: Based on different thermal effect requirements, select the appropriate type of laser and match it with suitable laser processing parameters to minimize thermal effects;

Industry Applications

The ultrafast infrared laser at 1064nm is suitable for ultraprecise cutting of metal thin plates, such as titanium alloy, high-temperature alloy, stainless steel, and more; Ultrafast green 532nm or ultraviolet 355nm picosecond lasers are suitable for brittle materials such as sapphire and optical glass, as well as heat-sensitive polymer and inorganic materials. They are primarily used for cutting and micro-drilling in novel microelectronic circuits of mobile phone covers, optical lens shapes, fingerprint recognition chips, liquid crystal panels, and inorganic materials; Ultrafast laser at 266nm is primarily utilized in micro-nano processing fields, including the manufacturing of flat panel displays, optical fiber communication equipment, and solar cells.

×

Order inquiry