超快激光微纳加工设备

  • 0-80mm

    Laser Power

  • 1064±5nm

    Accuracy

  • 800W

    Maximum Speed

  • 产品介绍

    采用高性能紫外激光器,激光功率稳定、光束质量好,切割端面光滑,具有较低的热应力及热影响,适用于超薄金属材料(铜、金、银、铝、钛、镍、不锈钢、钼等)、柔性材料(PET、PI、PP、PVC、铁氟龙、电磁膜、胶膜等)、石墨烯、碳纤维、硅片、陶瓷、FPC等材料的切割、打孔、表面微结构(仿生结构)、划线、刻槽处理,以及高分子材料、复合材料的微加工处理。

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    超快激光设备微纳精密优势

    皮秒冷却激光:皮秒冷却去除,无热作用,多种材料加工灵活性好;

    激光切割无应力:物质遇光升华,无需接触,免除应力破坏困扰,专用载具配合激光加工,即使元器件距离切割道非常紧密,也无应力影响,快速分板;

    热影响精确控制:根据不同的热影响要求,选择适合的激光器种类,配合适合的激光加工参数,最大限度降低热影响;

    Ultra-Efficient Electrode Foil Drying

    While traditional foil drying furnaces use fossil fuels and may be up to 100 meters long, laser drying eliminates the fossil fuel consumption carbon footprint and frees up factory floor space and infrastructure. The laser drying process dries over and under the foil surface simultaneously, making it faster and more power efficient than typical convective drying methods.

    Ultra-Efficient Electrode Foil Drying

    While traditional foil drying furnaces use fossil fuels and may be up to 100 meters long, laser drying eliminates the fossil fuel consumption carbon footprint and frees up factory floor space and infrastructure. The laser drying process dries over and under the foil surface simultaneously, making it faster and more power efficient than typical convective drying methods.

  • Drilling

    Quasi-CW fiber lasers are capable of achieving excellent hole quality at speeds of several thousand holes per second by utilizing a combination of high peak power and long pulse duration.

  • Welding

    Quasi-CW fiber lasers are capable of achieving excellent hole quality at speeds of several thousand holes per second by utilizing a combination of high peak power and long pulse duration.

  • Cutting

    Quasi-CW fiber lasers are capable of achieving excellent hole quality at speeds of several thousand holes per second by utilizing a combination of high peak power and long pulse duration.

  • 行业应用

    快红外激光1064nm适用于金属薄板超精密切割,如钛合金、高温合金、不锈钢等等精密切割;

    超快绿光532nm或者紫外355nm皮秒激光适用于蓝宝石、光学玻璃等脆性材料以及热敏感的高分子无机材料,主要用在手机盖板和光学镜头外形、指纹识别芯片、液晶面板、无机材料的新型微细电子电路的切割和微细钻孔;

    超快激光266nm主要用于制造平板显示器、光纤通信设备和太阳能电池等微纳加工领域。

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